Semiconductor Micromachining, Techniques and Industrial ApplicationsSemiconductor Micromachining - Fundamentals and Technology - is a two volume work in which, for the first time, the various disciplines associated with the theory and practice of device fabrication are brought together in one comprehensive reference source. Volume 1 contains a detailed coverage of semiconductor electrochemistry and physics whilst Volume 2 describes the wide range of microengineering technologies with details of practical applications. The authors for each chapter have been carefully selected for their expertise and are acknowledged leaders in their respective fields. The purpose of this book is to enable workers in the area of semiconductor micromachining to have ready access to the basic literature, essential to provide a solid basis for the many different aspects of physics, chemistry, electronics and engineering involved with this technology. The main focus of the book is on structures based on silicon, the most common and versatile of the current range of commercially available semiconductors, but other materials such as III-V semiconductors are also considered. Together these two volumes provide an indispensable reference text for this fast growing area of applied science. It will be of value to a wide range of academic and industrial scientists, technologists and engineers who wish to expand their knowledge in this area of science and for whom thus far, there has been no convenient reference work. Volume 1: Fundamental Electrochemistry and Physics |
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Contents
Etch Stops | 53 |
Photonic Integrated Circuits Technology and Concepts | 101 |
R Matz Chapter | 126 |
Copyright | |
8 other sections not shown
Common terms and phrases
addition allows anisotropic annealing anodic oxide Appl applications bonding chemical chip circuit compensation complex concentration cost defined density dependence deposited devices direction dissolution effect electrical Electrochem electrolyte Electron epitaxial etch rate etch stop etchants example fabrication Figure formation formed function grating grown growth hydrogen IEEE implantation important increased industry integrated interface isolation laser layer lithography material measured mechanical metal Microelectron micromachining microstructure mode n-type observed obtained optical output oxide films passivation pattern performance Phys planes possible potential pressure produce protocol range ratio reaction reduced region relatively resistance selectivity semiconductor sensor Sensors and Actuators shown shows signal silicon silicon oxide SiO2 smart solution standard step structure substrate surface technique temperature thermal thickness thin voltage wafer waveguide wavelength
Bibliographic information
| Title | Semiconductor Micromachining, Techniques and Industrial Applications Volume 2 of Semiconductor Micromachining, S. A. Campbell, ISBN 0471980846, 9780471980841 |
| Editors | S. A. Campbell, H. J. Lewerenz |
| Edition | illustrated, reprint |
| Publisher | Wiley, 1998 |
| Original from | the University of Virginia |
| Digitized | Aug 20, 2009 |
| ISBN | 0471966827, 9780471966821 |
| Length | 408 pages |
| Subjects | › › Science / Physics / Atomic & Molecular Science / Physics / Electricity Technology & Engineering / Electronics / Semiconductors |
| Export Citation | BiBTeX EndNote RefMan |