25th Electronic Components Conference, Statler Hilton Hotel, Washington D.C., May 12-14, 1975 |
Contents
A New HighPerformance Hybrid Filter for PCM Com | 1 |
Thick and Thin Film High Impedance Hybrid | 15 |
A Hybrid Communications Switching System R | 30 |
Copyright | |
24 other sections not shown
Common terms and phrases
adhesion alumina analysis applications assembly BALL BONDS beam lead bond strength bundle cable calculated capacitance capacitor ceramic characteristics chip coating component conductor connector contamination cost curve cycle device diameter dielectric diodes dissipation factor effect electrical electron epoxy equation etched factor fiber bundle Fiber Optic film resistors foil frequency function gold heat hybrid input interconnect interface laser trimmed layer lead frame leak rate load manufacturing material maximum measured mechanical metal method microcircuit mils module MTBF operation Optical Fiber oxide package parameters performance pins plastic plating plot pulse range reactively bonded relatively reliability resistor samples screening shear sheet resistance shown in Figure signal silicon solder stress substrate surface switch Table tantalum nitride techniques temperature termination Thermal Shocks thick film thin film tion transistor varistor voltage wire wire bonding