Proceedings of the 4th International Microelectronics Conference: May 28-30, 1986, International Conference Center, Kobe, Japan
International Society for Hybrid Microelectronics, 1986 - Microelectronics - 503 pages
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DesignedSpace Forming Technology in Ceramics
Statistical Analysis on Model Parameters of
17 other sections not shown
adhesion alumina alumina substrate aluminum anisotropic conductive film applications assembly atmosphere ball bonds bump capacitance capacitor cavity ceramic ceramic substrate characteristics circuit co-fired coefficient components composition connection copper copper ball cure cycles developed devices dielectric constant dissipation factor electrical electrodes epoxy etched evaluated Figure firing temperature formed GaSn glass heat heat-spreader high density high temperature humidity hybrid IMC 1986 Proceedings IMST increase insulating layer insulation resistance interface Japan Kobe laminated laser laser trimming lead manufacturing materials measured metal method microns module nitrogen oxide package pads paste pattern perovskite plating polyimide polymer printed properties resin resistance values resistor samples semiconductor sensor sheet resistivity shown in Fig shows silicon silver sintered solder stability strength structure substrate surface mounting Table thermal conductivity thermal resistance thick film thick film resistor tion trimmed varistors voltage VPCH wire bonding