Multilevel interconnection: issues that impact competitiveness : 27-28 September 1993, Monterey, California

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Contents

Development of reliable multilayer metallization for submicron ULSI technology 209003
3
Effects of ILD thickness and slopeetch depth on via performance and metal filling
53
Process integration issues in chemicalvapordeposited copperbased metallization 209007
63
Copyright

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