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Toward Determining Optimal Mechanical Properties in Adhesives for Flip Chip
Evaluation of a Low Cost Column Bump Technology
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addition adhesive allows alloy analysis angle applications approach assembly attach ball bonding bump challenges circuit clock compared components contactor cost curing cycling determine device diameter effect electronic evaluated example failure Figure flip chip flow flux force frequency function gold heat height higher improved increased integrated interface layer lead load loop lower manufacturing material measurement metal method modules mold operation optimized package parameters paste pattern performance pitch plasma plating presented production properties range reduce reference reflow reliability resistance sample scan semiconductor shown shows signal silicon simulation single solder solution specific stacked standard strength stress structure substrate surface surface tension Table technique temperature thermal thickness typically underfill wafer wetting wire wire bonding yield