Advances in Machining & Manufacturing Technology VIII: Selected Papers from the 8th Conference on Machining & Advanced Manufacturing Technology in China, November 15-17, 2005, Hangzhou, China
Trans Tech Publications, 2006 - Technology & Engineering - 888 pages
This work presents its readers with the most recent advances in the fields of machining and advanced manufacturing technology. It will be of especial valuable to production and research engineers, research students and academics.
49 pages matching silicon in this book
Results 1-3 of 49
What people are saying - Write a review
We haven't found any reviews in the usual places.
Experimental Study on Ultrasonic Grinding and Polishing for LargeScale Silicon Wafer
Virtual Reality in Optimizing the Groove of Blade
Primary Study of Polishing with Flotative Abrasive Balls
60 other sections not shown
2006 Trans Tech abrasive particles accuracy algorithm alloy analysis angle ceramic China chip coating coefficient curve cutter cutting edge cutting fluid cutting force cutting process cutting speed cutting tool decrease deformation density depth of cut diameter diamond film drill dynamic effect electrode end mill energy Engineering error experiments Fig.l fracture frequency friction function grain grinding wheel Harbin hardness high speed high-speed increase Keywords laser peening laser shock layer load machine tool machined surface matrix measured metal method micro microstructure milling milling cutter nanometer Natural Science Foundation nozzle optimization oxidation PID controller plasma polishing precision pressure pulse pulsed power radial rake face residual stress rotation speed sample Shandong University shown shows silicon simulation sintering structure substrate surface roughness Table Technology thermal thickness tool materials tool wear Trans Tech Publications Tribology ultrasonic ultrasonic vibration velocity wafer width workpiece