Microelectronic Interconnects and Packages: International Symposium on Advances in Interconnection and Packaging, 5-9 November 1990, Boston, Massachusetts, Volume 1389

Front Cover
Alfred P. DeFonzo

From inside the book

What people are saying - Write a review

We haven't found any reviews in the usual places.

Contents

Volume 1389
10
1389PLO3 Massive optical interconnections for computer applications
27
1389PLO4 Interconnect and packaging technology in the 90s
39
Copyright

12 other sections not shown

Common terms and phrases

Bibliographic information