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Inertial Sensors 24 3 Packaging Considerations for Very High Temperature
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accelerometer accuracy amplitude angle applications ASIC axis bias Brillouin calculated calibration cantilever capacitive capacitor characteristics chip circuit coefficient coil components configuration deflection dependent deposited detection detector developed device diaphragm diode displacement distance effect electrical electronics element energy equation error etching experimental fabrication fiber film force sensor function gyroscope Hall sensor heat hysteresis IEEE integrated layer linear magnetic field mass material measured mechanical Melexis membrane MEMS metal method micro offset operation optical optical fiber oscillation output oxide packaging parameters piezoelectric piezoresistors polysilicon pressure sensor pyroelectric range refractive index resistance resistor resonant frequency response rotation rotor Schottky diode sensing Sensors and Actuators shown in Figure shows signal silicon silicon nitride simulation strain sensitivity stress structure substrate surface micromachining technique temperature thermal thickness tion torque transducer transistor unijunction transistor velocity voltage wafer waveguide