Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1975 - Microelectronics |
Contents
Memory Devices | 1 |
Testing Problems Associated with a 4096 Bit MOS Memory by Don Knowlton | 8 |
A Testing Turnaround | 16 |
Copyright | |
20 other sections not shown
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addition aluminum analysis application assembly attach base beam beam lead bonding cause ceramic chip circuit complete conductive conductor cost cycle device diffusion effect electrical Electronic elements energy epoxy equipment failure Figure flame function glass gold heat hybrid implantation increase integrated circuits ion implantation layer lead frames limited logic machine manufacturers material measured memory metal method microelectronics microprocessor module molded operation output oxide package pads paste pattern performance pins plated position present problems production pulse radiation rays reduce reference reliability removal replacement resistance resistor seal selected semiconductor shown shows silicon silver silver plated solder standard step structure substrate surface Table technique temperature thermal thick film thin film tool typical units voltage wafer wire yield