Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium: Manufacturing Technologies--present and Future ; October 2-4, 1995, Austin, TX, USA
IEEE, 1995 - Electronic apparatus and appliances - 516 pages
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Call For Papers for the Eighteenth 1996 IEMT Symposium Austin TX USA
Flip Chip Process Development Techniques Using A Modified Laboratory Aligner Bonder
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active additional allows analysis application approach assembly bonding bumps calculated chip circuit complex components conducted cost cycle defects determine device distribution effect electronics Engineering equipment estimate evaluation experiments fabrication factors failure Figure flow flux force function heat improvement increase industry initial input inspection integrated laser layer lead machine manufacturing material mean measurement memory metal method module mounting obtained operation package parameters pattern performance planning possible prediction present problem procedures reduce reflow reliability resource sample scheduling semiconductor shown shows simulation solder solder joints solder paste specific specimen standard step stress structure substrate supply surface Table techniques temperature thermal thickness tool wafer wetting wire yield