2000 International Symposium on MicroelectronicsThis text constitutes proceedings from the International Symposium on Microelectronics that took place in Boston, Massachusetts in September, 2000. |
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Page 101
... annealing throughout the whole board , allowing most wirebonds to be annealed uniformly . The temperature of the ... annealing process helps to improve the pull strength . The current testing of the 5A and 7A without fan also resulted in ...
... annealing throughout the whole board , allowing most wirebonds to be annealed uniformly . The temperature of the ... annealing process helps to improve the pull strength . The current testing of the 5A and 7A without fan also resulted in ...
Page 102
... Annealing 1500 1400 1300 1200 1100 1000 900 800 82 8 & Annealing Time ( minute ) x Copper o Nickel + Gold Figure 3. Shear strength comparison for different metal surfaces on IMS after thermal annealing Pull Strength ( g ) 700 650 600 ...
... Annealing 1500 1400 1300 1200 1100 1000 900 800 82 8 & Annealing Time ( minute ) x Copper o Nickel + Gold Figure 3. Shear strength comparison for different metal surfaces on IMS after thermal annealing Pull Strength ( g ) 700 650 600 ...
Page 103
... annealing and the results had showed no significant change after temperature cycling ' . The annealing temperature was from 280 ° C to 400 ° C for up to 60 minutes on Direct Bonded Copper ( DBC ) substrate ' . For the wirebonds that had ...
... annealing and the results had showed no significant change after temperature cycling ' . The annealing temperature was from 280 ° C to 400 ° C for up to 60 minutes on Direct Bonded Copper ( DBC ) substrate ' . For the wirebonds that had ...
Contents
Corrosion Studies of mBGA Package | 15 |
Outstanding Papers | 41 |
406 | 43 |
Copyright | |
61 other sections not shown
Common terms and phrases
adhesive alloy aluminum analysis annealing applications assembly Ball Grid Array BGA package bond pad ceramic circuit board components conductor copper corrosion cost cure cured films density developed devices dielectric effect electrical electroless Electronic Packaging encapsulation epoxy Espanex etching eutectic failure fatigue fired film flip chip frequency gold heat sink IEEE IMAPS increase integrated interconnection interface laminate laser layer LTCC manufacturing material measured mechanical metal method Microelectronics microns module moisture multilayer optimization parameters pattern performance plastic plating polyimide polymer printed circuit board properties reflow reliability resin resistance resistor sample semiconductor sensor shear strength shown in Figure shows silicon simulation solder ball solder bump solder joint solder paste stress structure substrate surface Table techniques temperature thermal cycling thick film thin film underfill viscosity wafer wire wirebonds