2000 International Symposium on MicroelectronicsThis text constitutes proceedings from the International Symposium on Microelectronics that took place in Boston, Massachusetts in September, 2000. |
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Page 160
Robust Assembly Technology for Surface Mount Leadless Ceramic Components on Organic Circuit Boards Deployed in an Outside - Plant Wireless Base - Station System Robert W. Kotlowitz Distinguished Member of Technical Staff Lucent ...
Robust Assembly Technology for Surface Mount Leadless Ceramic Components on Organic Circuit Boards Deployed in an Outside - Plant Wireless Base - Station System Robert W. Kotlowitz Distinguished Member of Technical Staff Lucent ...
Page 472
... assembly variables , and were highly accelerated to isolate the significant factors . The first variable chosen was finish on the board traces and pad areas . The conductive traces on the test board were copper , but copper needs a ...
... assembly variables , and were highly accelerated to isolate the significant factors . The first variable chosen was finish on the board traces and pad areas . The conductive traces on the test board were copper , but copper needs a ...
Page 675
... assembly capabilities . Fine pitch geometries are being incorporated on the first bond because of aggressive silicon shrinks on Aluminum and Copper interconnect devices . This drives the need for wire bonded substrates with finer pitch ...
... assembly capabilities . Fine pitch geometries are being incorporated on the first bond because of aggressive silicon shrinks on Aluminum and Copper interconnect devices . This drives the need for wire bonded substrates with finer pitch ...
Contents
Corrosion Studies of mBGA Package | 15 |
Outstanding Papers | 41 |
406 | 43 |
Copyright | |
61 other sections not shown
Common terms and phrases
adhesive alloy aluminum analysis annealing applications assembly Ball Grid Array BGA package bond pad ceramic circuit board components conductor copper corrosion cost cure cured films density developed devices dielectric effect electrical electroless Electronic Packaging encapsulation epoxy Espanex etching eutectic failure fatigue fired film flip chip frequency gold heat sink IEEE IMAPS increase integrated interconnection interface laminate laser layer LTCC manufacturing material measured mechanical metal method Microelectronics microns module moisture multilayer optimization parameters pattern performance plastic plating polyimide polymer printed circuit board properties reflow reliability resin resistance resistor sample semiconductor sensor shear strength shown in Figure shows silicon simulation solder ball solder bump solder joint solder paste stress structure substrate surface Table techniques temperature thermal cycling thick film thin film underfill viscosity wafer wire wirebonds