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1389PLO3 Massive optical interconnections for computer applications
1389PL04 Interconnect and packaging technology in the 90s
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achieve analysis applications approach approximately array beam bonding ceramic characteristics chip circuit communication complex components conductor connections constant cost coupling density dependent described devices dielectric distribution effect electrical electronic elements example fabrication fiber field Figure frequency function GaAs geometry ground high speed Hybrid illustrated implemented important increase integrated integrated circuits interconnect interface laser layers leads length light limited logic loss manufacturing materials measurements memory metal method microstrip Microwave mode Multichip Modules operation optical optical interconnects optoelectronic packaging parallel performance physical plane polyimide possible present problem processor propagation pulse resistance shown in Figure shows signal silicon simulation single solution space structure substrate surface switching techniques termination thermal transfer transmission line unit wafer waveguide wire