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1389PLO3 Massive optical interconnections for computer applications
1389PLO4 Interconnect and packaging technology in the 90s
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analysis applications approach approximately array ceramic characteristics chip circuit communication complex components conductivity conductor connections constant cost coupled dependent described developed devices dielectric dispersion distribution effect electrical electronic elements example fabrication field Figure frequency function GaAs geometry ground high speed Hybrid IEEE Trans illustrated implemented important increase inductance integrated integrated circuits interconnect issues laser layers leads length light limited logic loss materials measured memory metal method Microelectronics microstrip Microwave mode modeling Multichip Modules obtained operation optical optoelectronic packaging parameters performance physical plane Polyimide possible present problem processor propagation pulse rates resistance shown in Fig shows signal silicon simulation single skin solutions space structure substrate surface techniques termination thermal Thin Film transmission line values wafer waveform waveguide wiring