Materials Science of Microelectromechanical Systems (MEMS) DevicesArthur H. Heuer, S. Joshua Jacobs |
Contents
Recent Developments in Experimental and Theoretical | 3 |
Influence of Specimen Size and SubMicron Notch on | 15 |
Dependence of Silicon Fracture Strength and Surface | 21 |
Copyright | |
35 other sections not shown
Common terms and phrases
actuators alumina angle anisotropy annealed applications atomic force microscope atoms bonds CDCl3 ceramic chemical coating coefficient components copper curvature curve cycle decrease deposition developed DXRL electron energy etch rate experimental fabricated film thickness fluorinated focused ion beam fracture strength frit function grain high aspect ratio images increases ion beam ion milling laser layer LIGA load mA/cm² magnetic magnetostrictive material measured mechanical properties MEMS MEMS devices metal micro-optical microcomponents microelectromechanical systems microgear micrograph micromachining microspecimens microstructure mold nitride nucleus density oxide parameters partially sintered particles photoresist piezoelectric plasma plating platinum PMMA polyimide polysilicon pressure residual stress room temperature sample sensor shown in Figure shrinkage sidewalls silica silicon sintered sol-gel solution specimen sputtering strain structures substrate surface roughness tape techniques tensile thermal expansion thin film transducer trench wafer width x-ray x-ray lithography Young's modulus