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Systematic and Random Defect Reduction During the Evolution of Integrated Circuit Technology
Real Time Failure Analysis of Cu Interconnect Defectivity Through Bitmap Overlay Analysis
Vikas R Sheth Hai Nguyen Patrick Dao A Mark Miscione APRDL Motorola
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addition alignment allows analysis applications approach average calculated capacity cause chamber chemical classification clean compared components copper cost critical cycle defect density deposition determine device effect electrical engineering equipment etch example excursion experiments fabrication failure Figure flow function gate given identified images impact implant implemented important improvement increase inspection integrated issues layer learning limits lithography loss manufacturing material measured metal method monitor obtained operator optimization overlay oxide parameters particle pattern performance physical polysilicon possible presented probe problem range recipe reduce resist reticle sampling Semiconductor shown shows silicon simulation specific step strategy surface Table techniques temperature thickness throughput tool University utilization values variation wafer yield