Cleaning Technology in Semiconductor Device Manufacturing ...: Proceedings of the International SymposiumElectrochemical Society, 2002 - Semiconductor wafers |
Contents
SINGLEWAFER SPIN CLEANING WITH REPETITIVE | 3 |
EVALUATION OF NEW MEGASONIC SYSTEM FOR SINGLE | 15 |
ADVANCED SINGLE CHEMISTRY ALKALINE CLEANING | 23 |
Copyright | |
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Common terms and phrases
acid addition adsorbed adsorption amount APM+ atoms/cm² carbon chelating agents chemical oxide chemistries cleaning efficiency cleaning process Cleaning Technology concentration contact angle copper corrosion CryoKinetic decreased defects deposition device dielectric dilute HF dual damascene effect Electrochem ellipsometry etch rate EXPERIMENTAL film FTIR gate oxide hafnium heavy organic Heyns HF solution HF-last high-k high-k dielectric Hydrozone increased ionic ions KLA Tencor liquid low-k measured megasonic cleaning metal contamination metal removal metallic impurities native oxide NH4OH organic contaminants oxide etching oxide growth oxide thickness oxygen ozonated water ozone particle removal efficiency photoresist pre-gate clean quartz rod RCA cleaning reaction reduced residue rinse Ruzyllo sample SC-1 solutions SCROD Semiconductor shows silicate silicon oxide silicon surface silicon wafers single wafer SiO2 spectra spin cleaning step substrate supercritical fluid surfactants thermal oxide vapor wafer cleaning wafer surface wet cleaning