Low-dielectric Constant Materials IV: Symposium Held April 14-16, 1998, San Francisco, California, U.S.A., Volume 4

Front Cover
Chien Chiang, P. S. Ho
Materials Research Society, 1998 - Technology & Engineering - 386 pages
The 49 papers focus on the areas of polymeric and inorganic low-k dielectrics, metrology and materials characterization, the process integration of low-k interconnects, and the reliability of low-k dielectrics. Among other topics, the invited papers discuss fundamental aspects of polymer metallization, ion-beam techniques for characterizing low-k materials, low-dielectric constant materials integration challenges, integration issues for diamond-like carbon in a copper damascene process flow, and the chemical-mechanical planarization of the polymer interlayer dielectrics. Annotation copyrighted by Book News, Inc., Portland, OR

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