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Optical Laser Probe for Solder
ZAxis Conductive Adhesives
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adhesive alumina aluminum analysis applications ASICs assembly capacitance capacitors ceramic ceramic substrate components conductor connector copper cost density deposited detector developed devices dielectric constant dielectric layer electrical electronic emulsion epoxy equipment etching European Hybrid Microelectronics fabrication failure Figure film technology Flip Chip frequency gold Green Tape heat hermetic holes hybrid circuits insulation integrated interconnection interface laser laser soldering lead manufacturing materials measured mechanical metallisation method Microelectronics microns multilayer optical optical amplifier package pads parameters pattern performance pitch planar plate polyimide polymer power converter production reflow reflow soldering reliability resistors screen printing semiconductor sensor shear shown shows silicon silicon sensors solder bumps solder joints solder paste stacked stresses structure substrate Surface Mount techniques thermal conduction thermal cycling thick film thin film transistor voltage waveguide width wire bonding wire bumping