ProceedingsDutch Efficiency Bureau, 1979 - Hybrid integrated circuits |
Contents
François | 48 |
F Sleeckx T Naten A Van de Capelle and J Vandewege | 88 |
the Used InsulatorSemiconductor Combinations | 199 |
Copyright | |
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adhesion Alphamet alumina aluminium applications AuAl ball bonds capacitance capacitors CC-packages ceramic cermet chips coating coefficient components conductivity Conference 1979 current noise curve dependence devices dielectric dissipation dissipation factor effect electrical electronic encapsulated epoxy Erie etching evaporated experimental factor Figure filter firing cycles firing temperature frequency function Ghent glass heat hybrid circuit IEEE increase input insulator integrated circuits L-cut layer lead frame manufacturers material measured mechanism mesh metal Microelectronics NiCr obtained oxide package paper parameters particles pattern performance plastic porcelain enameled preamplifier printed circuit board Proc production properties range refiring screen printing semiconductor sensor sheet resistivity shown in Fig shows silicon sintering solar cell solder sputtering stability steel structure substrate surface TABLE technique thermal thick film resistors thin film thin film circuits transistors trimming tuning ultrasonic values voltage wedge bonds welding wire bonding