Proceedings |
Contents
Wireless Applications | 1 |
Statistical Experimental Design for Optimizing | 79 |
Laser Processing in the Microelectronics Industry Method using an Electrooptic Probe | 84 |
Copyright | |
57 other sections not shown
Common terms and phrases
adhesive applications assembly ball grid array bond bump capacitors ceramic cofired components conductor copper cost cure developed devices diameter die attach dielectric constant effect electrical Electronic Packaging encapsulant epoxy etching evaluated fabricated failure filter flip chip frequency heat sink high density hole increase inductors insulation integrated interconnection interface laminate laser layer LTCC manufacturing material MCM-L measured mechanical metal method Microelectronics microstrip microwave module mold compound Mosfets mounted multilayer NuBGA optical parameters performance pitch plating polyimide polymer printed printed circuit board properties reduced reflow reliability resin resistance resistor resonator samples semiconductor shear shown in Figure shows signal silicon simulation solder balls solder joint stress structure substrate surface Table technique temperature thermal conductivity thick film underfill values voltage wafer waveguide wire wirebond