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Page 209
... silicon integration has accelerated , a gap has been growing between the minimum die size that is needed to support the silicon functionality ( core limited die size ) and that supported by number of I / O pads and their pitch ( pad ...
... silicon integration has accelerated , a gap has been growing between the minimum die size that is needed to support the silicon functionality ( core limited die size ) and that supported by number of I / O pads and their pitch ( pad ...
Page 543
... silicon substrate , also known as LCOS ( liquid crystal on silicon ) displays , are emerging [ 1,2,5,6,7 ] . In most cases the displays are of the reflective type . Despite the high cost of silicon processing , this technology offers a ...
... silicon substrate , also known as LCOS ( liquid crystal on silicon ) displays , are emerging [ 1,2,5,6,7 ] . In most cases the displays are of the reflective type . Despite the high cost of silicon processing , this technology offers a ...
Page 972
... silicon die and the mold compound . Of the six packages die bonded with 1095-29 , this was the only one that did not have domed passivation and delamination between the top of the silicon die and the mold compound . Delamination was ...
... silicon die and the mold compound . Of the six packages die bonded with 1095-29 , this was the only one that did not have domed passivation and delamination between the top of the silicon die and the mold compound . Delamination was ...
Contents
Wireless Applications | 1 |
Statistical Experimental Design for Optimizing | 79 |
Laser Processing in the Microelectronics Industry Method using an Electrooptic Probe | 84 |
Copyright | |
57 other sections not shown
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adhesive applications assembly ball grid array bond bump capacitors ceramic cofired components conductor copper cost cure developed devices diameter die attach dielectric constant effect electrical Electronic Packaging encapsulant epoxy etching evaluated fabricated failure filter flip chip frequency heat sink high density hole increase inductors insulation integrated interconnection interface laminate laser layer LTCC manufacturing material MCM-L measured mechanical metal method Microelectronics microstrip microwave module mold compound Mosfets mounted multilayer NuBGA optical parameters performance pitch plating polyimide polymer printed printed circuit board properties reduced reflow reliability resin resistance resistor resonator samples semiconductor shear shown in Figure shows signal silicon simulation solder balls solder joint stress structure substrate surface Table technique temperature thermal conductivity thick film underfill values voltage wafer waveguide wire wirebond