Infrared Technology, Issue 15SPIE--the International Society for Optical Engineering, 1989 - Infrared technology |
Contents
TENYEAR UPDATE | 75 |
MORE SCIENTIFIC AND MILITARY APPLICATIONS | 101 |
THERMAL IMAGING | 135 |
Copyright | |
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Common terms and phrases
absorption alignment amplifier analysis anamorphic applications average background band bias blackbody calculated calibration camera channel circuit COLLIMATOR configuration dark current defective pixels detection detector array developed device dynamic range electronics element emissivity energy error exit pupil failure field filter FLIR focal plane array function heat transfer HgCdTe IFOV Imaging Sensors infrared input InSb integration laser layer lens limits linear LOWTRAN-6 measured micron mirror module MOSFET multiplexer noise Nusselt operation optical output parameters performance photodetector photodetector arrays photodiode pixel platinum silicide probe programme quantum efficiency radiance radiation radiometric readout region response samples scan scanner Schottky barrier sensitivity SENTRAN signal processing silicide simulation sorting network spatial frequencies spatial resolution spectral SPIE SPRITE substrate surface target technique temperature Thermal Imaging TICM transmittance values voltage wafer wavelength yield µVrms