Modern Solder Technology for Competitive Electronics Manufacturing
Solder is the common interconnecting material for electronic packaging and assembly, providing electrical, thermal and mechanical functions. This text provides coverage of all relevant technologies related to the applications of solder, covering the fundamental principles involved in each process, but also relating those principles to the execution of practical applications. It also provides the working solder knowledge needed to implement an electronic manufacturing system using any of the new technologies available.
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Advanced Surface Mount and Die Attach
Table 310 Atomic Size and Crystal Structure of Elements
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acid ambient applications assembly atmosphere Ball Grid Array BGA package C-BGA chemical chemistry circuit cleaning coating cooling rate coplanarity copper cost crack Creep curve cycling deformation dispensing electrical Electronic Packaging electroplated etching eutectic fatigue Figure flip chip flow rate flux/vehicle system heat increases interface intermetallic lead manufacturing metal microstructure molten solder no-clean oxides pads parameters particles paste deposit Pb solder joint percent performance Phase diagram pitch plastic pressure printing Proceedings NEPCON-West production reflow oven reflow process Reflow Soldering residue resistance rheology rosin shear shown in Fig Sn-Pb Sn/37 Pb solder solder alloy solder balls solder bumps solder composition solder fillet solder interconnections solder joint solder paste solder powder solid specific squeegee stencil stencil thickness strain stress substrate Surface Mount Technology Table technique thermal tion vapor versus viscosity water-clean wave soldering wetting wire bonding