Proceedings of the RETMA Conference on Reliable Electrical ConnectionsEngineering Publishers., 1958 - Electronic circuits |
Contents
Behavior of Soldered Joints in Printed Circuits | 1 |
Shielded Wire Terminations | 24 |
Quality Control Plan for Electrical Connections | 39 |
Copyright | |
13 other sections not shown
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Common terms and phrases
alloy aluminum amperes applications assembly assure basis metal bolting force characteristics coating components conducted contact resistance copper corrosion crimp connection crimping cycles deformation dip soldering effect electrical connection electrical resistance electronic electroplated equipment evaluation exposure eyelet factors failure rate flux function fusing galvanic corrosion heat humidity improved inch increase initial insertion force inspection installation insulation resistance Kure Beach material max min avg measured mechanical megohms ment method missile nector nickel Nickel plated one-part connectors operation percent performance phosphor bronze pigtail leads plug potential drop printed circuit boards printed wiring boards problem production quality control ratio requirements rhodium samples shown in Fig shows Silver plated socket solder connections solder cup specification splice standard steel Steubenville strength surface techniques Telnic terminal thermal thermocouple thickness Thin None Heavy tion tool ultrasonic welds values vibration voltage drop VSWR