Proceedings of the RETMA Conference on Reliable Electrical ConnectionsEngineering Publishers., 1958 - Electronic circuits |
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Page 84
... coating should be ap- proximately one mil thick and be applied in two coats . A drying step should be carried out between applications of the coating . A final oven cure of the coating should yield a thin , adherent , uniform film . The ...
... coating should be ap- proximately one mil thick and be applied in two coats . A drying step should be carried out between applications of the coating . A final oven cure of the coating should yield a thin , adherent , uniform film . The ...
Page 223
... coatings even when covered by a flash of either gold or rhodium . Of the gold finishes , the lowest values were obtained with the thickest coating , 0.0002 inch , while those for 0.0001 inch and 0.00003 inch were slightly higher and ...
... coatings even when covered by a flash of either gold or rhodium . Of the gold finishes , the lowest values were obtained with the thickest coating , 0.0002 inch , while those for 0.0001 inch and 0.00003 inch were slightly higher and ...
Page 230
... coating are poor . 3. Sliding lowers the contact resistance of many coatings , par- ticularly the softer coatings . 4. Copper and phosphor bronze are preferred basis metals for contacts . Yellow brass is the least desirable basis metal ...
... coating are poor . 3. Sliding lowers the contact resistance of many coatings , par- ticularly the softer coatings . 4. Copper and phosphor bronze are preferred basis metals for contacts . Yellow brass is the least desirable basis metal ...
Contents
Behavior of Soldered Joints in Printed Circuits | 1 |
Shielded Wire Terminations | 24 |
Quality Control Plan for Electrical Connections | 39 |
Copyright | |
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alloy aluminum amperes applications assembly assure basis metal bolting force characteristics coating components conducted contact resistance copper corrosion crimp connection crimping cycles deformation dip soldering effect electrical connection electrical resistance electronic electroplated equipment evaluation exposure eyelet factors failure rate flux function fusing galvanic corrosion heat humidity improved inch increase initial insertion force inspection installation insulation resistance Kure Beach material max min avg measured mechanical megohms ment method missile nector nickel Nickel plated one-part connectors operation percent performance phosphor bronze pigtail leads plug potential drop printed circuit boards printed wiring boards problem production quality control ratio requirements rhodium samples shown in Fig shows Silver plated socket solder connections solder cup specification splice standard steel Steubenville strength surface techniques Telnic terminal thermal thermocouple thickness Thin None Heavy tion tool ultrasonic welds values vibration voltage drop VSWR