Proceedings of the RETMA Conference on Reliable Electrical ConnectionsEngineering Publishers., 1958 - Electronic circuits |
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Page 8
... failure rate is zero per million . In the second test the failure rate is 586 per million . In the first test we have a failure rate range ( at the 10 percent limits ) of zero per million to 1.737 per million . In the second test our ...
... failure rate is zero per million . In the second test the failure rate is 586 per million . In the first test we have a failure rate range ( at the 10 percent limits ) of zero per million to 1.737 per million . In the second test our ...
Page 166
... failure . How- ever , most of the difficulties with one - part connectors ... rate ; on the other hand , it may simply re- flect familiarity with existing ... failure rate for these components . 4. The elimination of certain tests from ...
... failure . How- ever , most of the difficulties with one - part connectors ... rate ; on the other hand , it may simply re- flect familiarity with existing ... failure rate for these components . 4. The elimination of certain tests from ...
Page 216
... failure Percentage of total failures Random Wearout Fabrication Mishandling Human factors Dependent Design 52 10 9 7 ... rate . The failure rates listed in Table I are based on random causes and as such would only represent approximately ...
... failure Percentage of total failures Random Wearout Fabrication Mishandling Human factors Dependent Design 52 10 9 7 ... rate . The failure rates listed in Table I are based on random causes and as such would only represent approximately ...
Contents
Behavior of Soldered Joints in Printed Circuits | 1 |
Shielded Wire Terminations | 24 |
Quality Control Plan for Electrical Connections | 39 |
Copyright | |
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alloy aluminum amperes applications assembly assure basis metal bolting force characteristics coating components conducted contact resistance copper corrosion crimp connection crimping cycles deformation dip soldering effect electrical connection electrical resistance electronic electroplated equipment evaluation exposure eyelet factors failure rate flux function fusing galvanic corrosion heat humidity improved inch increase initial insertion force inspection installation insulation resistance Kure Beach material max min avg measured mechanical megohms ment method missile nector nickel Nickel plated one-part connectors operation percent performance phosphor bronze pigtail leads plug potential drop printed circuit boards printed wiring boards problem production quality control ratio requirements rhodium samples shown in Fig shows Silver plated socket solder connections solder cup specification splice standard steel Steubenville strength surface techniques Telnic terminal thermal thermocouple thickness Thin None Heavy tion tool ultrasonic welds values vibration voltage drop VSWR