Proceedings of the RETMA Conference on Reliable Electrical ConnectionsEngineering Publishers., 1958 - Electronic circuits |
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Page 197
... to use actual parts in the proposed environment for a considerable period of time . While this can rarely be done , any test should 197 Galvanic Corrosion of Simulated Electrical Connectors in Dilute Salt Spray Martin S Frant.
... to use actual parts in the proposed environment for a considerable period of time . While this can rarely be done , any test should 197 Galvanic Corrosion of Simulated Electrical Connectors in Dilute Salt Spray Martin S Frant.
Page 198
... galvanic corrosion could not occur with- out current flowing through the external circuit . Although a high humidity would be the most common environ- ment , it was necessary to decrease the resistance of the test cell by impregnation ...
... galvanic corrosion could not occur with- out current flowing through the external circuit . Although a high humidity would be the most common environ- ment , it was necessary to decrease the resistance of the test cell by impregnation ...
Page 203
... galvanic corrosion and can be recommended in this type of environment . The copper - nickel couple appears to be entirely satisfactory corrosion - wise . Tin - lead ( solder ) with ... Corrosion , Causes and Frant : Galvanic Corrosion 203.
... galvanic corrosion and can be recommended in this type of environment . The copper - nickel couple appears to be entirely satisfactory corrosion - wise . Tin - lead ( solder ) with ... Corrosion , Causes and Frant : Galvanic Corrosion 203.
Contents
Behavior of Soldered Joints in Printed Circuits | 1 |
Shielded Wire Terminations | 24 |
Quality Control Plan for Electrical Connections | 39 |
Copyright | |
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alloy aluminum amperes applications assembly assure basis metal bolting force characteristics coating components conducted contact resistance copper corrosion crimp connection crimping cycles deformation dip soldering effect electrical connection electrical resistance electronic electroplated equipment evaluation exposure eyelet factors failure rate flux function fusing galvanic corrosion heat humidity improved inch increase initial insertion force inspection installation insulation resistance Kure Beach material max min avg measured mechanical megohms ment method missile nector nickel Nickel plated one-part connectors operation percent performance phosphor bronze pigtail leads plug potential drop printed circuit boards printed wiring boards problem production quality control ratio requirements rhodium samples shown in Fig shows Silver plated socket solder connections solder cup specification splice standard steel Steubenville strength surface techniques Telnic terminal thermal thermocouple thickness Thin None Heavy tion tool ultrasonic welds values vibration voltage drop VSWR