Proceedings of the RETMA Conference on Reliable Electrical ConnectionsEngineering Publishers., 1958 - Electronic circuits |
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Page 120
... initial resistance of both groups were measured as : ultrasonic capacitor discharge 0.0036 ohm 0.00373 ohm The joints may therefore be considered identical in conductivity . Because the size of the capacitor discharge weld is quite ...
... initial resistance of both groups were measured as : ultrasonic capacitor discharge 0.0036 ohm 0.00373 ohm The joints may therefore be considered identical in conductivity . Because the size of the capacitor discharge weld is quite ...
Page 121
... initial resistance for the C - C group do not show or indicate that these joints are any poorer than the others . However , over a period of 6000 hours , there is the definite tendency toward joint deterioration . This would mean that ...
... initial resistance for the C - C group do not show or indicate that these joints are any poorer than the others . However , over a period of 6000 hours , there is the definite tendency toward joint deterioration . This would mean that ...
Page 223
... initial measurement the current and voltage were reduced to zero . The wires were then slid one against the other while the force was still applied to them . After this sliding the contact re- sistance was again measured . This sliding ...
... initial measurement the current and voltage were reduced to zero . The wires were then slid one against the other while the force was still applied to them . After this sliding the contact re- sistance was again measured . This sliding ...
Contents
Behavior of Soldered Joints in Printed Circuits | 1 |
Shielded Wire Terminations | 24 |
Quality Control Plan for Electrical Connections | 39 |
Copyright | |
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alloy aluminum amperes applications assembly assure basis metal bolting force characteristics coating components conducted contact resistance copper corrosion crimp connection crimping cycles deformation dip soldering effect electrical connection electrical resistance electronic electroplated equipment evaluation exposure eyelet factors failure rate flux function fusing galvanic corrosion heat humidity improved inch increase initial insertion force inspection installation insulation resistance Kure Beach material max min avg measured mechanical megohms ment method missile nector nickel Nickel plated one-part connectors operation percent performance phosphor bronze pigtail leads plug potential drop printed circuit boards printed wiring boards problem production quality control ratio requirements rhodium samples shown in Fig shows Silver plated socket solder connections solder cup specification splice standard steel Steubenville strength surface techniques Telnic terminal thermal thermocouple thickness Thin None Heavy tion tool ultrasonic welds values vibration voltage drop VSWR