Proceedings of the RETMA Conference on Reliable Electrical ConnectionsEngineering Publishers., 1958 - Electronic circuits |
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Page 76
... material for bond strength , blistering , and insulation resistance . Periodic checks of the resin content of the base material are necessary to control the coefficient of expansion . For example , tests of thermal expansion ...
... material for bond strength , blistering , and insulation resistance . Periodic checks of the resin content of the base material are necessary to control the coefficient of expansion . For example , tests of thermal expansion ...
Page 136
... material ; E. is the modulus of elasticity of the conductor material , and E is the modulus of elasticity of the dumbbell material . The results were also analyzed on the basis of thermal conductivity . Table I shows the values of the ...
... material ; E. is the modulus of elasticity of the conductor material , and E is the modulus of elasticity of the dumbbell material . The results were also analyzed on the basis of thermal conductivity . Table I shows the values of the ...
Page 270
... material such as tin , cadmium , or gold . But in general it is the hardness of the material that determines a difference in stripping force . An extremely hard material such as tungsten carbide , often used as a test terminal , gives a ...
... material such as tin , cadmium , or gold . But in general it is the hardness of the material that determines a difference in stripping force . An extremely hard material such as tungsten carbide , often used as a test terminal , gives a ...
Contents
Behavior of Soldered Joints in Printed Circuits | 1 |
Shielded Wire Terminations | 24 |
Quality Control Plan for Electrical Connections | 39 |
Copyright | |
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alloy aluminum amperes applications assembly assure basis metal bolting force characteristics coating components conducted contact resistance copper corrosion crimp connection crimping cycles deformation dip soldering effect electrical connection electrical resistance electronic electroplated equipment evaluation exposure eyelet factors failure rate flux function fusing galvanic corrosion heat humidity improved inch increase initial insertion force inspection installation insulation resistance Kure Beach material max min avg measured mechanical megohms ment method missile nector nickel Nickel plated one-part connectors operation percent performance phosphor bronze pigtail leads plug potential drop printed circuit boards printed wiring boards problem production quality control ratio requirements rhodium samples shown in Fig shows Silver plated socket solder connections solder cup specification splice standard steel Steubenville strength surface techniques Telnic terminal thermal thermocouple thickness Thin None Heavy tion tool ultrasonic welds values vibration voltage drop VSWR