Advanced PackagingAdvanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages. |
Common terms and phrases
2007 ADVANCED PACKAGING achieve adhesive alloys AlN heater applications April 2007 ADVANCED assembly Awano burn-in C4NP carbon nanotube catalyst particles CNT bumps Compression-mount Sockets cooling cost density deposition device Diane Donnelly die-attach materials die-bond dispensing E-mail effluent electronics engineers ethyl cellulose eutectic Figure flip chip gallium nitride Global GROUP PUBLISHER heat dissipation heatsink Henkel high thermal High-lead solder industry Interconnect lead-free leadframe low-k manufacturing mask cleaning mechanical dicing MEMS metal micro MicrobondGecko NATIONAL SALES MANAGER needs NuSil oleoyl oxide paste residue performance Ph.D Probe Card reflow reliability removed requirements sarcosine screening masks semiconductor sensors Sercel silicon solder alloys solder bumping solder joint solder pastes Solder wire solution source bump spray squeegee substrate surface temperature uniformity Test Socket thermal conductivity thermal fatigue Thermshield tion Umicore Vectron void rate wafer bumping wafer dicing WAFER LEVEL wire bonding Witvrouw www.apmag.com April 2007