Thermal Management Handbook: For Electronic Assemblies

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McGraw Hill Professional, 1998 - Technology & Engineering - 650 pages
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In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

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Thermal Effects on Electronic Circuits Jerry Sergent 2
Thermal Properties of Electronic Material
Heat Generation in Electronic Circuits

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About the author (1998)

Jerry E. Sergent, Ph.D., is the Director of Technology for TCA, Inc. Al Krum is an Engineering Manager at Hughes Aircraft. He also teaches hybrid and MCM classes at UCLA and Berkeley, as well as for IMAPS.

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