Thermal Management Handbook: For Electronic Assemblies
In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
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Thermal Effects on Electronic Circuits Jerry Sergent 2
Thermal Properties of Electronic Material
Heat Generation in Electronic Circuits
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alumina aluminum ambient applied boundary conditions calculated capacitance capacitor ceramic chip circuit card cold plate component computational conductor constant cooling copper curve defined density devices diameter die attach dielectric diode effect electrical energy epoxy equation failure rate FIGURE fins flow rate fluid forced convection frequency grid heat flow heat flux heat pipe heat sink heat source heat transfer coefficient Hybrid inch increase inductor interface laminar flow layer length liquid loss materials metal method Microelectronics module MOSFET natural convection Nusselt Nusselt number oxide parameters perature percent power dissipated pressure properties radiation resistors result semiconductor sheet resistivity shown in Fig silicon solder solution spreading angle stress substrate surface Table Tantalum thermal analysis thermal conductivity thermal design thermal management thermal resistance thick film tion transistor triac turbulent flow types typically values vapor velocity view factor voltage volts watts wire bond