Modeling of Materials and Its Applications in Advanced TechnologiesC. H. Chu This book contains the proceedings of Symposium L of the International Conference on Materials for Advanced Technologies, held from the 1st to the 6th of July, 2001 in Singapore. The aim of this important meeting was to bring together researchers and engineers having very different backgrounds, and thus promote free discussion and the exchange of ideas across many interdisciplinary boundaries. |
Contents
Preface V | 1 |
A SelfConsistent Scheme for Asperity Contact | 17 |
Novel Methods to Measure Residual Stresses in Thin Films | 31 |
Copyright | |
14 other sections not shown
Common terms and phrases
2002 Trans Tech alloys analysis angle aspect ratio asperity atoms axial bonded boundary Burgers vector calculations composite constitutive equation coordination number crack tip curve deflection deformation density deviatoric dislocation distribution dynamic effect elastic elastic modulus energy experimental extrusion fibre finite element Finite element analysis foam fracture frequency friction function geometry grain hydrogen hysteresis increasing indentation interface lattice layer loading manufacturing matrix maximum measured mechanical membrane thickness MEMS metal method micro pump microstructure Nanyang Technological University obtained parameters particle phase phonon Phys plane plastic polymer predicted process and material properties PZT disk thickness quantum dots residual stress sample shape memory alloys shear stress shown in Fig shrinkage silicon simulation singular exponent sintering sintering stress solid specimen stress intensity substrate surface temperature tensile thermal thin films Trans Tech Publications viscoelastic void volume fraction WebMEMS-MAS Young's modulus