Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1978 - Hybrid integrated circuits |
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Contents
Effects of CoFiring Small Geometry Termination EBeam Lithography by Paul R Ashley and William S C Chang Washington University St Louis | 1 |
S scr 33 TiceF Fesscrs | 2 |
PreTesting of Active Device Chips for Use in St Paul | 10 |
Copyright | |
16 other sections not shown
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Common terms and phrases
active addition adhesion aging aluminum analysis applications assembly average bonding bump calculated characteristics chip circuit compared components conductivity conductor containing copper cost cycle determine developed devices dielectric display DuPont effect electrical Electronic epoxy evaluation fabrication failure Figure firing function glass gold Group heat higher hybrid included increase indicate initial laser layer lead manufacturers material measured mechanical metal method microcircuit microelectronics minutes moisture mounted obtained operation package pads paste pattern percent performance present printed problems production properties pull range reliability resistance resistor samples screen sealing selected shear sheet shown in Figure shows solder specific stability standard strength stress substrate surface Table tape technique temperature termination thermal thick film thin tion trimming typical units viscosity wire yield
Bibliographic information
| Title | Proceedings of the ... International Microelectronics Symposium |
| Contributor | International Society for Hybrid Microelectronics |
| Publisher | International Society for Hybrid Microelectronics, 1978 |
| Original from | University of Illinois at Urbana-Champaign |
| Digitized | Sep 30, 2011 |
| Export Citation | BiBTeX EndNote RefMan |