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INTERNATIONAL MICROELECTRONICS SYMPOSIUM
Security Agency Ft Meade MD
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adhesion alumina alumina substrate aluminum analysis assembly beam tape BTAB bump ceramic Cermalloy chip circuit conductor cone contaminants copper cost cycle devices dielectric DuPont effect electrical Electronic epoxy etching evaluation fabrication failure fired film Fresnel lens glass gold heat hermeticity Hi-MIC hybrid circuits hybrid microcircuits interface intermetallic ISHM L-cut laser trimming layer lead leak rate leak test manufacturers materials measured metal method micro microelectronics moisture levels multilayer operation package pads parameters paste pattern percent performance platinum polyimide printed problems production pull strength pull testing range reflow reliability resistor samples screening sealing semiconductor sensor shear rate shear stress sheet resistivity shown in Figure shows solder stability standard stress substrate surface Table tantalum nitride technique thermal thick film thick film resistors thin film tion transistors typical viscosity voltage wire bonding yield