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Effects of CoFiring Small Geometry Termination EBeam Lithography by Paul R Ashley and William S C Chang Washington University St Louis
S scr 33 TiceF Fesscrs
PreTesting of Active Device Chips for Use in St Paul
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active addition adhesion aging aluminum analysis applications assembly average bonding bump calculated characteristics chip circuit compared components conductivity conductor containing copper cost cycle determine developed devices dielectric display DuPont effect electrical Electronic epoxy evaluation fabrication failure Figure firing function glass gold Group heat higher hybrid included increase indicate initial laser layer lead manufacturers material measured mechanical metal method microcircuit microelectronics minutes moisture mounted obtained operation package pads paste pattern percent performance present printed problems production properties pull range reliability resistance resistor samples screen sealing selected shear sheet shown in Figure shows solder specific stability standard strength stress substrate surface Table tape technique temperature termination thermal thick film thin tion trimming typical units viscosity wire yield