Microelectronic Failure Analysis: Desk Reference : 2002 SupplementThis book/CD-ROM package, the 2002 Supplement to the Microelectronic Failure Analysis Desk Reference, 4th edition, is the second update to the 4th edition, following the 2001 Supplement. The main themes addressed are analysis techniques for submicron defects, failure analysis of microelectromechani |
Contents
Investigation of a Low Voltage PWB CAF Failure | 107 |
Application of Scanning Acoustic Microscopy to Electric and Electronic Parts | 115 |
Chiaki Miyasaka Bernhard Tittman | 125 |
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Common terms and phrases
acoustic analytical Application Auger Bond capacitors cause Ceramic Characterization chip Circuits CMOS coating components contamination Contrast copper cross-sectional damage defect depth determine Devices dielectric distribution effects electrical Electron elements Emission encapsulation energy etch Evaluation example failed Failure Analysis failure mechanism field Figure film Focused frequency gate oxide glass heat identification improved increase indicates inspection Integrated interface internal Ion Beam Laser layer limit Mass material measurements mechanism MEMS metal method Microscopy mode molding nitrogen observed obtained operation Optical Packages particle performed Plastic Power preparation present Probe problem Raman spectroscopy region Reliability removed resistors resolution sample Scanning secondary Semiconductor short shown shows signal silicon silver SIMS Solder specimen Spectroscopy structures Study substrate surface Techniques Technology temperature Testing Thermal thickness thin tool types typically voltage wave X-ray