Proceedings of the ... International Microelectronics Symposium

Front Cover
International Society for Hybrid Microelectronics, 1983 - Microelectronics
0 Reviews

From inside the book

What people are saying - Write a review

We haven't found any reviews in the usual places.


An Experimental Approach to Vapor Phase Reflow Solder Assembly 171 Ball Bond Shearing A Complement to the Wire Bond Pull Test
Direct Mounting of Ceramic Leadless Chip Carrier onto Glass Epoxy
Surface Mounted Device Hybrid Module Technology TradeOffs in CoChairmen R Wayne Johnson Eaton Corp

28 other sections not shown

Other editions - View all

Common terms and phrases

Bibliographic information