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Ablebond adhesion alloy alumina alumina substrates aluminum analysis assembly attach automated ball bonds brazed capacitors ceramic cerdip chip carriers components conductive conductor copper cost cure cycle density developed devices dielectric effect electrical Electronics epoxy eutectic evaluation failure fired fired films function glass gold heat hermetic hybrid circuit increase interconnect interface laser laser trim layer leadless chip carriers manufacturing material measured metal Microelectronics module multilayer ohms oxide package parameters paste pattern percent performance plasma process plated polyimide polymer printed pull test pulse reflow reliability resin resistance resistor samples screen sealing semiconductor sensor shear rate shear strength shear test sheet resistance shown in Figure shows silicon silver solvent standard stress substrate surface Table techniques temperature tensile thermal thick film thin film tion trim ultrasonic vapor viscosity voltage weld wire bond