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An Experimental Approach to Vapor Phase Reflow Solder Assembly 171 Ball Bond Shearing A Complement to the Wire Bond Pull Test
Direct Mounting of Ceramic Leadless Chip Carrier onto Glass Epoxy
R Wayne Johnson Eaton Corp
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Ablebond adhesion alloy alumina aluminum analysis assembly attach automated ball bonds ball shear bondability braze capacitors ceramic cerdip chip carriers components conductive conductor copper cost cure cycle density developed devices diameter die attach dielectric effect electrical Electronics epoxy eutectic evaluation failure fillet fired fired films function glass gold heat hermetic hybrid circuit increase interconnect interface laser laser trim layer manufacturing material measured metal Microelectronics module multilayer ohms oxide package parameters paste pattern percent performance plasma process plated polyimide polymer printed production pull test pulse reflow reliability resin resistance resistor samples screen sealing semiconductor sensor shear rate shear strength shear test shown in Figure shows silicon silver solvent standard stress substrate surface Table techniques temperature tensile thermal thick film tion trim ultrasonic vapor viscosity voltage welded width wire bond