Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1983 - Microelectronics |
Common terms and phrases
Ablebond adhesion alloy alumina alumina substrates aluminum analysis assembly attach automated ball bonds brazed capacitors ceramic chip carriers components conductive conductor copper cost cure cycle density developed devices die attach dielectric effect electrical Electronics epoxy eutectic evaluation failure fired fired films function glass gold hermetic hybrid circuit increase interconnect interface laser laser trimming layer lead leadless chip carriers manufacturing material measured metal Microelectronics module multilayer ohms oxide package parameters paste pattern percent performance plasma process plated polyimide polymer printed pull test pulse reflow reliability resin resistance resistor samples screen sealing semiconductor sensor shear rate shear strength shear test shown in Figure shows silicon silver solvent standard stress substrate surface Table technique temperature tensile thick film thin film tion trimmed ultrasonic vapor viscosity voltage weld wire bond