Hybrid Microelectronics Handbook
Jerry E. Sergent, Charles A. Harper
McGraw-Hill, Jan 1, 1995 - Technology & Engineering - 768 pages
Featuring new contributions from experts in the field, the second edition of the Handbook provides electronics design, process, and packaging engineers with the data they need to design, test, and manufacture today's most-wanted hybrid microcircuits.
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Introduction to Hybrid Microelectronics
Barlow Bradley Department of Electrical Engineering Virginia Polytechnic University
Electronic Packaging of Hybrid Circuits
14 other sections not shown
adhesion airflow alumina aluminum nitride anodization applications beryllia braze capacitance capacitor ceramic ceramic substrate chemical chip cleaning cleanroom coefficient components composition conductive phase contamination density deposited devices dielectric constant dielectric materials dissipation factor effect electrical electron etching evaporation factor failure analysis Figure firing flow frequency glass gownup heat HEPA hybrid assembly hybrid circuits increase insulating interconnection interface laser trimming layer measured mechanical method Microelec multilayer oxide package parameters particles paste paste rheology performance photoresist plating Proc properties pure copper metallization reflow result rheology sample screen printing shear rate sheet resistance shown in Fig silicon sintering solder solid solvent sputtering strength stress structure substrate substrate materials surface mount Table tantalum techniques temperature thermal conductivity thick film dielectrics thick film resistors thin film tion typically viscosity voltage wire bonding