1995 International Symposium on Microelectronics: 24 - 26 October 1995, Los Angeles, California

Front Cover

From inside the book

Contents

Hard Ball Grid Arrays for Pluggable BGA Connector
1
Highly Reliable Ceramic BGA Dave Kellerman MATERIAL SOLUTIONS John Bugeau
13
Voiding Mechanism in BGA Assembly 083 Metal Impregnated Carbon Composites for Thermal
24
Copyright

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