Proceedings of the 3rd International Microelectronics Conference: May 21-23, 1984, Keio Plaza Hotel, Tokyo, Japan

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International Society for Hybrid Microelectronics, 1984 - Hybrid integrated circuits - 498 pages

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Contents

MATERIALS AND COMPONENTS
41
Production Processes for Thin Film Metallization
72
New Thick Film Capacitor Dielectrics by S J Stein
97
Copyright

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