Proceedings of the 3rd International Microelectronics Conference: May 21-23, 1984, Keio Plaza Hotel, Tokyo, Japan |
From inside the book
Results 1-3 of 45
Page 238
... hole metalization and the aluminum conductor layer formation . Figure 6 shows a cross - section after metalization ... hole structure was included in the fabricated patterns . ( A ) is a straight connection via hole which was fabricated ...
... hole metalization and the aluminum conductor layer formation . Figure 6 shows a cross - section after metalization ... hole structure was included in the fabricated patterns . ( A ) is a straight connection via hole which was fabricated ...
Page 347
... hole widens and there is a very shallow hole in the centre +/- 45 um : a wide surface area is melted and some shallow holes 2-3 um in diameter are drilled in the melt +/- 50 um melting only occurs +/- 65 um : melting becomes difficult ...
... hole widens and there is a very shallow hole in the centre +/- 45 um : a wide surface area is melted and some shallow holes 2-3 um in diameter are drilled in the melt +/- 50 um melting only occurs +/- 65 um : melting becomes difficult ...
Page 352
... holes and crossing lines . Strip lines are most commonly used in the inter- nal layers of multilayer circuit boards . A through - hole passes through ground planes perpen- dicular to the through - hole , and crossing lines cross each ...
... holes and crossing lines . Strip lines are most commonly used in the inter- nal layers of multilayer circuit boards . A through - hole passes through ground planes perpen- dicular to the through - hole , and crossing lines cross each ...
Contents
MATERIALS AND COMPONENTS | 41 |
Production Processes for Thin Film Metallization | 72 |
New Thick Film Capacitor Dielectrics by S J Stein | 97 |
Copyright | |
22 other sections not shown
Common terms and phrases
adhesion alloy alumina alumina substrate aluminum applications ball bond beryllia Birox broadcasting capacitance carbon ceramic characteristics chip carriers components composition conductor conventional copper film copper layer cost cycles density developed devices dielectric constant dissipation factor EDLC effect electrical resistivity electronic epoxy experimental Figure film resistor fired frequency furnace glass gold heat hole humidity hybrid circuits hybrid ICs IMC 1984 Proceedings IMST substrate increase insulation resistance Japan laser trimming lines manufacturing materials measured metal microelectronics MMC substrate module multilayer obtained oxide package parameters particles paste pattern Pd/Ag performance phase plate polyimide printed Proc production properties reduced reliability resin resistor samples satellite semiconductor sensor sheet resistivity shown in Fig shows silicon sintering solder stability structure surface Table temperature thermal resistance thick film capacitors through-hole Tokyo unit cells varistors voltage wire bond