Solder Paste Technology: Principles and Applications |
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Page 135
... normally of cast or tubular aluminum . The area of the screen to be imaged normally represents a maximum of about 60 percent of the total area inside the frame . This image area is coated with an emulsion that has been exposed to high ...
... normally of cast or tubular aluminum . The area of the screen to be imaged normally represents a maximum of about 60 percent of the total area inside the frame . This image area is coated with an emulsion that has been exposed to high ...
Page 149
Principles and Applications Colin C. Johnson, Joseph Kevra. the etching depth would normally be 50 percent into each side . The maximum aperture size should normally be not more than 1.2 times the stencil thickness . After completion of ...
Principles and Applications Colin C. Johnson, Joseph Kevra. the etching depth would normally be 50 percent into each side . The maximum aperture size should normally be not more than 1.2 times the stencil thickness . After completion of ...
Page 229
... normally caused by the outgassing of solvent or moisture that has penetrated the surface of the solder joint . These contaminants can normally be eliminated by adequate preheating of the assembly prior to reflow in order to expel ...
... normally caused by the outgassing of solvent or moisture that has penetrated the surface of the solder joint . These contaminants can normally be eliminated by adequate preheating of the assembly prior to reflow in order to expel ...
Contents
Powder Processing and Classification | 1 |
Flux Classification | 41 |
Problems and Troubleshooting Procedures | 223 |
Copyright | |
5 other sections not shown
Common terms and phrases
acid alloy amine applications assembly ASTM behavior board or substrate Brookfield cause centipoises Chapter classified cleaning components composition containing copper mirror corrosion degrees F depends dispensing electronic energy eutectic example flow fluid flux activity flux residues formulation halide heat inch Increase paste infrared intermetallic ionic liquid material measurement melting point mesh metal content metal loading microns normally oxidation pads paste deposition paste viscosity plate powder particle preheat printed wiring board properties reflow temperature reflowed solder removal resins result rheological rosin sample Screen Printing shear rate shown in FIG silver chromate slump solder alloy solder balls solder joint solder paste solder paste flux solder powder solution solvent specification squeegee stencil stress substance surface insulation resistance surface-mount technology tack force tack retention Tacky test methods thermal thickness thixotropic tin-lead alloy vapor viscoelastic viscometer viscosity wave soldering wave-soldered wetting