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alloy amine applications assembly behavior board or substrate boiling point cause centipoises Chapter chloride classified cleaning components composition containing copper mirror corrosion deformation degrees F depends dispensing electronic energy equipment eutectic excessive flow fluid flux activity flux residues formulation halide heat inch industry infrared intermetallic ionic liquid material measurement melting point mesh metal content metal loading microns Newtonian fluid normally oxides pads paste deposition paste manufacturers percent lead plate powder particle preheating printed wiring board range reduced reflow temperature reflowed solder removal resins result rheological rosin sample screen shear rate shown in FIG slump solder alloy solder balls solder joints solder paste solder paste flux solder powder solvent specification squeegee stencil stress substance surface insulation resistance surface-mount technology tack retention thermal thick-film thickness thixotropic tin-lead alloy vapor viscoelastic viscometer viscosity wave soldering wave-soldered wetting