Solder Paste Technology: Principles and Applications |
Contents
Powder Processing and Classification | 1 |
Flux Classification | 41 |
Problems and Troubleshooting Procedures | 223 |
Copyright | |
5 other sections not shown
Common terms and phrases
acid alloy amine applications assembly ASTM behavior board or substrate Brookfield cause centipoises Chapter classified cleaning components composition containing copper mirror corrosion degrees F depends dispensing electronic energy eutectic example flow fluid flux activity flux residues formulation halide heat inch Increase paste infrared intermetallic ionic liquid material measurement melting point mesh metal content metal loading microns normally oxidation pads paste deposition paste viscosity plate powder particle preheat printed wiring board properties reflow temperature reflowed solder removal resins result rheological rosin sample Screen Printing shear rate shown in FIG silver chromate slump solder alloy solder balls solder joint solder paste solder paste flux solder powder solution solvent specification squeegee stencil stress substance surface insulation resistance surface-mount technology tack force tack retention Tacky test methods thermal thickness thixotropic tin-lead alloy vapor viscoelastic viscometer viscosity wave soldering wave-soldered wetting