Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1977 - Microelectronics |
Contents
Papers preceded by an asterisk were | 5 |
George G Harman National Bureau of Standards | 15 |
SESSION | 41 |
Copyright | |
11 other sections not shown
Common terms and phrases
Ablefilm adhesive alumina amount amplifier applications assembly bond strength bumps capacitors ceramic Cermalloy chip carrier coating components composition conductivity conductor materials copper curing developed devices dielectric constant diffusion DuPont effect electrical Electronic EMCA epoxy evaluated fabricated failure firing frequency function gold Group high temperature hybrid circuits inch increase interconnect laser laser trimming layer lead frame load manufacturers mass loss measured mechanical metal method micro shear microstrip Microwave module multilayer noise operation Optimum Exposure outgassing output Overglaze package pads Pd/Ag percent performed photoresist piezoelectric plated pressure range resistors samples screen sealing sheet resistivity shown in Figure shows solder specimens substrate surface Table techniques temperature cycling thermal aging thick film thick film conductor thick film resistors thin film tion transistor trimming types ultrasonic voltage water vapor width wire bonding