1969 Electronic Components Conference, April 30, May 2, 1969 |
Contents
The Future of DC Brushless Electromechanical Devices | 1 |
Temperature Compensated Strain Gage for Biomedical Instrumentation | 8 |
A Hybrid Linear Power Amplifier | 15 |
41 other sections not shown
Common terms and phrases
alloy alumina aluminum amplifier anode applications assembly beam leads bumps capacitance capacitor ceramic substrate characteristics components conductor conductor pattern configuration coupler crossover curves cycling density deposited device dielectric dielectric constant dissipation factor effect electrical electrode electromigration equation etched fabrication failure film thickness filter flip-chip frequency function glass gold heat sink hermetic hybrid hybrid circuit impedance inch input integrated circuit interconnection interface Kapton layer material measured metal method module monolithic multilayer NNNN ohms operation operational amplifier output oxide package pads parameters PHOTOMASK plate range reliability resistors S-Band samples screen seal shear sheet resistance shown in Figure silicon solder sputtering strate strength stress substrate surface switch techniques temperature coefficient thermal resistance thermistor thick film thin film tion transistor trimmer typical ultrasonic bonding values variation voltage wire wire bonding