1997 International Symposium on Microelectronics
IMAPS--International Microelectronics and Packaging Society, 1997 - Technology & Engineering - 707 pages
Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).
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Surface Micromachined Solenoid Inductors for Nemours GmbH Jens Muller Micro Systems Engineer
Coupling Between Adjacent Finite Ground G T Wells The Dow Chemical Company Greg Gibson Carl Newquist FAS Technologies
The Multilayer Ceramic Integrated Circuits Electronics Devices Inc SMI Susumu Nishigaki Robert
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adhesive alumina analysis applications assembly Ball Grid Array bond capacitance capacitors CBGA ceramic circuit coating cofired components composite conductor copper cost density deposition developed devices diameter dielectric constant effect electrical electronic encapsulation epoxy evaluation fabrication failure flip chip flux frequency GaAs glass heat sink heat spreader impedance increase inductor integrated interconnect interface laminate layer LTCC manufacturing material measured metal Microelectronics module molding multilayer NuBGA oxide package parameters passive passive components performance pitch plastic plating polyimide polymer printed production reflow reliability resin resistors samples semiconductor sensor shown in Figure shows silicon solder balls solder bump solder joint solder paste sphere stress structure substrate surface mount Table technique temperature thermal conductivity thermal cycling thermal resistance thick film thin film typical underfill values voltage wafer wire wire bonding wirebond