Advanced Materials Sourcebook |
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Page 32
... heat sink is greatly enhanced by the high thermal conductivity of the diamond . Many of the items in this section ... heat wafers in electronic devices , as heat sink materials , and as a heat conducting protective film for thermal ...
... heat sink is greatly enhanced by the high thermal conductivity of the diamond . Many of the items in this section ... heat wafers in electronic devices , as heat sink materials , and as a heat conducting protective film for thermal ...
Page 96
... heat exchangers , heat insulators and substrates for printed circuits . Low organic content ceramic fibre textiles pass the fire test Ceramic fibre textiles that have been heat treated to remove combustible organic materials are now ...
... heat exchangers , heat insulators and substrates for printed circuits . Low organic content ceramic fibre textiles pass the fire test Ceramic fibre textiles that have been heat treated to remove combustible organic materials are now ...
Page 178
... heat resistance , of nylon 46 responds readily to mould temperature . The heat distortion temperature ( HDT ) of 149 ° C ( 300 ° F ) at 1.82 MPa ( 264 psi ) for unfilled resin , shown in Table 2.1 , is achieved with a mould at 79 ° C ...
... heat resistance , of nylon 46 responds readily to mould temperature . The heat distortion temperature ( HDT ) of 149 ° C ( 300 ° F ) at 1.82 MPa ( 264 psi ) for unfilled resin , shown in Table 2.1 , is achieved with a mould at 79 ° C ...
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addition advanced ceramics Advanced Composites Advanced Materials aerospace aircraft alloy alumina aluminium applications aramid automotive boron carbon fibre centre ceramic fibres ceramic materials chemical chemical vapour deposition claimed coating commercial composite materials compounds conventional Corp cost density developed diameter electrical electronic engineering epoxy fabrication filament furnace grades heat high performance high temperature improved increase industry injection moulding involved Japan Japanese joint venture Kevlar Laboratory laminates laser Ltd Tokyo machine manufacturing matrix mechanical properties metal metal-matrix composites million modulus nylon Osaka oxide oxygen Plastics polyester polyetheretherketone polyethylene polyimide polymer Pont powder preforms prepreg pressure production programme pultrusion range resin resistance result route silicon carbide silicon nitride sintering structural substrates superconducting superconducting ceramic surface techniques tensile strength thermal thermoplastic thermosetting thin films titanium Tokyo tooling University vapour deposition whiskers zirconia