Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2011:, Volume 1335

Front Cover
Mikhail R. Baklanov, Geraud Dubois, Christian Dussarrat, Terukazu Kokubo, Shinichi Ogawa
Materials Research Society, Nov 21, 2011 - Technology & Engineering - 140 pages
This volume includes selected papers based on the presentations given at Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics," held at the April 25−29, 2011 MRS Spring Meeting in San Francisco, California. The symposium included topics relating to low-k dielectrics, integration, reliability, metallization, packaging and emerging technologies.

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