Optoelectronic Integrated Circuits and Packaging III: 28-29 January, 1999, San Jose, CaliforniaMichael R. Feldman, James G. Grote, Mary K. Hibbs-Brenner |
Contents
Optical interconnects for highspeed data links 363103 | 10 |
Preparation of SiO on an InP substrate by a solgel technique for integrated optics 363113 | 13 |
Optical transposition transform interconnects using a freespace and fiber hybrid module | 37 |
Copyright | |
17 other sections not shown
Common terms and phrases
alignment amplifier applications beam bias bondwires capacitance cavity channels chip CLDA CMOS CMOS-SEED components configuration cost coupler coupling crosstalk detector devices diffraction electrical crosstalk emitter equivalent circuit etching fabrication fiber array Figure film flip-chip flip-chip bonding free-space frequency function GaAs high-speed hybrid integration IEEE Photon imaging InGaAs input insertion loss Integrated Circuits integrated optical January 1999 SPIE laser diode layer layout lens array lenslet Lett measured micro-optical microlens micromirror mirror mode multiple quantum nm VCSEL OEIC on-chip operation optical fiber optical interconnects optical power optoelectronic output packaging pads parameters performance photodetector photodiode photolithography photonic planar PLC platform polyimide QWIP refractive semiconductor sensor shown in Fig shunt signal silicon simulation smart pixels solder SPIE Vol structure substrate surface switching technique temperature thermal transmission transposition transform v-groove VCSEL VCSEL array VCSEL driver VLSI voltage wafer wavelength